The T-862++ uses an Infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents. Infrared soldering technology with independent exploration capabilities via three (3) focus lenses which are included with the package. Technician focused infrared heat is easy to target most component removal/replacement and re-work. The Workstation has a 120 X120mm a 650W controlled Pre-heating System. Infrared heat source bulbs are long-lived, in-expensive and easily replaced. Processor controlled set-point regulated temperatures with thermocouple feed-back. Integrated and adjustable Infrared (IR) eye protection. Can suitable for the entire component, especially Micro BGA component. The T-862++ system also contains a temperature controlled touch-up iron and stand. Extra soldering tools are not necessary to solder/unsolder and re-work Surface MountTechnology (SMT) components 15-35mm. Output power: 800W Infra-red lamp body temperature adjustable: 100-250 Preheating dish temperature adjustable: 60-200